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- W2334335658 abstract "Fabricating electrodes for Micro Sinking Electro Discharge Machining (Micro-SEDM) using thin-film technology is an attractive alternative to conventional processes. A lithography process taking advantage of a positive photoresist to create a micro mold for electroplating was optimized to reach a thickness in the order of 200 µm at a maximal structure aspect ratio of 10 (structure diameter 20 µm). The resist stability during the electroplating process was investigated. Sample micro Cu electrodes with a length of 167 µm could be deposited in micro mold with a maximal aspect ratio of 8. The paper provides simulation results for Cu and W micro electrodes, a fabrication process for the microelectrode mentioned above, as well as experimental investigations regarding their usage in a Micro-SEDM process." @default.
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- W2334335658 date "2009-05-15" @default.
- W2334335658 modified "2023-10-18" @default.
- W2334335658 title "Electroplated Cu Micro Electrode for the Application in Micro Sinking Electro Discharge Machining (Micro-SEDM)" @default.
- W2334335658 doi "https://doi.org/10.1149/1.3140027" @default.
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