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- W2336224427 abstract "Sn-rich Au–Sn solder bonding has been systematically investigated for low cost and low temperature wafer-level packaging of high-end MEMS devices.The AuSn2 phase with the highest Vickers-hardness among the four stable intermetallic compounds of the Au–Sn system makes a major contribution to the high bonding shear strength.The maximum shear strength of 64 MPa and a leak rate lower than 4.9×10-7 atm·cc/s have been obtained for Au46Sn54 solder bonded at 310 ℃.This wafer-level low cost bonding technique with high bonding strength can be applied to MEMS devices requiring low temperature packaging." @default.
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- W2336224427 date "2013-01-01" @default.
- W2336224427 modified "2023-09-23" @default.
- W2336224427 title "Low temperature Sn-rich Au-Sn wafer-level bonding" @default.
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