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- W2337695122 abstract "In this paper, an on-chip 3-D capacitor with multi-layer technology is proposed for RF application in the frequency range of (10–100) GHz. The demand for miniaturization of on chip passive devices, for instance, filter applications in the higher frequency range (RF-VLSI technology), is growing and to meet those requirements the multi-layer technology supports it. The simulation and design of the proposed structure is carried out for retrieving the quality factor and capacitance of 3-D capacitor and planar capacitor thus portraying the comparisons inherent thereof. Thus, a 30% improvement in quality factor and 20% improvement in capacitance is observed for 3-D capacitor over planar capacitor. The miniature chip area with a size of 50×50µm2, renders it for radio frequency applications." @default.
- W2337695122 created "2016-06-24" @default.
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- W2337695122 date "2015-12-01" @default.
- W2337695122 modified "2023-09-26" @default.
- W2337695122 title "High Q on-chip 3-D capacitor for RF applications" @default.
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- W2337695122 doi "https://doi.org/10.1109/indicon.2015.7443236" @default.
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