FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2337943147> ?p ?o ?g. }

• W2337943147 endingPage "001393" @default.
• W2337943147 startingPage "001373" @default.
• W2337943147 abstract "Chip-Package Interaction (CPI) is a significant concern for modern electronic devices and this concern is magnified for 3D Stacked IC. Hard bumps, soft dielectrics, thin die and complex geometries of the stacked die require an ability to model and evaluate the interactions and risks. In packaged IC, dissimilar materials along with the thermal history during the assembly process results in significant residual stresses. These stresses can impact process yields, reliability and die electrical performance. Examples of these effects are ball cracking, ILD/ELK cracking or delamination and shifts in the behavior of sensitive devices such as transistors in analog circuits. Traditionally modeling and evaluation of these risks have been handled by different groups/companies (foundry, OSAT, Fabless Device Mfg) and have been hindered by the difficulty of using different tools and more importantly collaborating without revealing proprietary models and process information/recipes. In this paper we present a modeling flow which incorporates a seamless interface between the tools traditionally used for both package and silicon modeling. This is accomplished by utilizing Boundary Conditions (BC's) to act as a hand-off between the two simulation tools. A package level modeling approach is developed incorporating package assembly processes to predict residual stresses at the end of package assembly process. This package level simulator uses a nested sub-modeling approach for detailed extraction of stresses at different locations within BEOL layers of die, u-bumps, and C4 bumps from package level simulations. Additionally, it allows complete flexibility in selecting boundaries at chip-package interface and then the extraction of BC's necessary for die and transistor level simulations. These boundaries for Chip-Package Interaction are selected by the device manufacturer and the output from this simulation is fed into device level simulations. To provide flexibility for the user and to attain quick turnaround time, a web hosted interface is enabled to run package simulations online. The capabilities of this modeling approach are demonstrated by studying the impact of design and material parameters on stresses at various interconnect structures constituting a typical 3D IC stack package. An example of active silicon layer stress correlation from package level model and die-level model will be presented, thus validating this overall modeling flow." @default.
• W2337943147 created "2016-06-24" @default.
• W2337943147 creator A5000739142 @default.
• W2337943147 creator A5015473688 @default.
• W2337943147 creator A5038762565 @default.
• W2337943147 creator A5047227717 @default.
• W2337943147 creator A5071695766 @default.
• W2337943147 creator A5072003003 @default.
• W2337943147 date "2012-01-01" @default.
• W2337943147 modified "2023-09-25" @default.
• W2337943147 title "A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures" @default.
• W2337943147 doi "https://doi.org/10.4071/2012dpc-wa12" @default.
• W2337943147 hasPublicationYear "2012" @default.
• W2337943147 type Work @default.
• W2337943147 sameAs 2337943147 @default.
• W2337943147 citedByCount "2" @default.
• W2337943147 countsByYear W23379431472014 @default.
• W2337943147 countsByYear W23379431472017 @default.
• W2337943147 crossrefType "journal-article" @default.
• W2337943147 hasAuthorship W2337943147A5000739142 @default.
• W2337943147 hasAuthorship W2337943147A5015473688 @default.
• W2337943147 hasAuthorship W2337943147A5038762565 @default.
• W2337943147 hasAuthorship W2337943147A5047227717 @default.
• W2337943147 hasAuthorship W2337943147A5071695766 @default.
• W2337943147 hasAuthorship W2337943147A5072003003 @default.
• W2337943147 hasConcept C105795698 @default.
• W2337943147 hasConcept C111106434 @default.
• W2337943147 hasConcept C111919701 @default.
• W2337943147 hasConcept C119599485 @default.
• W2337943147 hasConcept C126233035 @default.
• W2337943147 hasConcept C127413603 @default.
• W2337943147 hasConcept C159985019 @default.
• W2337943147 hasConcept C160671074 @default.
• W2337943147 hasConcept C162877825 @default.
• W2337943147 hasConcept C165005293 @default.
• W2337943147 hasConcept C165013422 @default.
• W2337943147 hasConcept C184788189 @default.
• W2337943147 hasConcept C186260285 @default.
• W2337943147 hasConcept C192562407 @default.
• W2337943147 hasConcept C199639397 @default.
• W2337943147 hasConcept C24326235 @default.
• W2337943147 hasConcept C2779227376 @default.
• W2337943147 hasConcept C2780598303 @default.
• W2337943147 hasConcept C33923547 @default.
• W2337943147 hasConcept C41008148 @default.
• W2337943147 hasConcept C50296614 @default.
• W2337943147 hasConcept C530198007 @default.
• W2337943147 hasConcept C68928338 @default.
• W2337943147 hasConcept C69567186 @default.
• W2337943147 hasConcept C76155785 @default.
• W2337943147 hasConcept C78519656 @default.
• W2337943147 hasConcept C79072407 @default.
• W2337943147 hasConcept C94709252 @default.
• W2337943147 hasConcept C98045186 @default.
• W2337943147 hasConceptScore W2337943147C105795698 @default.
• W2337943147 hasConceptScore W2337943147C111106434 @default.
• W2337943147 hasConceptScore W2337943147C111919701 @default.
• W2337943147 hasConceptScore W2337943147C119599485 @default.
• W2337943147 hasConceptScore W2337943147C126233035 @default.
• W2337943147 hasConceptScore W2337943147C127413603 @default.
• W2337943147 hasConceptScore W2337943147C159985019 @default.
• W2337943147 hasConceptScore W2337943147C160671074 @default.
• W2337943147 hasConceptScore W2337943147C162877825 @default.
• W2337943147 hasConceptScore W2337943147C165005293 @default.
• W2337943147 hasConceptScore W2337943147C165013422 @default.
• W2337943147 hasConceptScore W2337943147C184788189 @default.
• W2337943147 hasConceptScore W2337943147C186260285 @default.
• W2337943147 hasConceptScore W2337943147C192562407 @default.
• W2337943147 hasConceptScore W2337943147C199639397 @default.
• W2337943147 hasConceptScore W2337943147C24326235 @default.
• W2337943147 hasConceptScore W2337943147C2779227376 @default.
• W2337943147 hasConceptScore W2337943147C2780598303 @default.
• W2337943147 hasConceptScore W2337943147C33923547 @default.
• W2337943147 hasConceptScore W2337943147C41008148 @default.
• W2337943147 hasConceptScore W2337943147C50296614 @default.
• W2337943147 hasConceptScore W2337943147C530198007 @default.
• W2337943147 hasConceptScore W2337943147C68928338 @default.
• W2337943147 hasConceptScore W2337943147C69567186 @default.
• W2337943147 hasConceptScore W2337943147C76155785 @default.
• W2337943147 hasConceptScore W2337943147C78519656 @default.
• W2337943147 hasConceptScore W2337943147C79072407 @default.
• W2337943147 hasConceptScore W2337943147C94709252 @default.
• W2337943147 hasConceptScore W2337943147C98045186 @default.
• W2337943147 hasIssue "DPC" @default.
• W2337943147 hasLocation W23379431471 @default.
• W2337943147 hasOpenAccess W2337943147 @default.
• W2337943147 hasPrimaryLocation W23379431471 @default.
• W2337943147 hasRelatedWork W1585722462 @default.
• W2337943147 hasRelatedWork W1669786280 @default.
• W2337943147 hasRelatedWork W2065586335 @default.
• W2337943147 hasRelatedWork W2110051111 @default.
• W2337943147 hasRelatedWork W2130847291 @default.
• W2337943147 hasRelatedWork W2134343375 @default.
• W2337943147 hasRelatedWork W2153888382 @default.
• W2337943147 hasRelatedWork W2155179766 @default.
• W2337943147 hasRelatedWork W2541204255 @default.
• W2337943147 hasRelatedWork W2544446123 @default.
• W2337943147 hasVolume "2012" @default.

• next