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- W2342804969 abstract "In this paper, forced convection reflow soldering is simulated using an existing numerical model which accounts for multimode effects and is capable of predicting large and small scale thermal and species concentration phenomena. Soldering is performed in an oven equipped with porous panel heaters through which air or nitrogen is introduced to the reflow environment. The gas is injected selectively through top or bottom infrared heaters in order to (1) dampen gas temperature fluctuations which can be established by thermal buoyancy forces and (2) minimize nitrogen use. The results reveal the utility of general process models of the reflow operation as applied to oven design. The effects of mixed convection on heat and gas species transport in the oven are also revealed, and the potential impact on the solidification process is discussed." @default.
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- W2342804969 date "1995-12-31" @default.
- W2342804969 modified "2023-09-22" @default.
- W2342804969 title "Simulation of forced convection-infrared reflow soldering with nitrogen injection" @default.
- W2342804969 hasPublicationYear "1995" @default.
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