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- W2344477413 abstract "Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging techniques challenge the conventional PFA techniques and require new approaches. This article provides an overview of recent results in this domain achieved at Fraunhofer IWM." @default.
- W2344477413 created "2016-06-24" @default.
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- W2344477413 date "2016-06-01" @default.
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- W2344477413 title "Innovative Failure Analysis Techniques for 3-D Packaging Developments" @default.
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- W2344477413 doi "https://doi.org/10.1109/mdat.2016.2521828" @default.
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