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- W2345481035 abstract "This paper presents the main observations and results obtained from CFD simulations for lead free SnAgCu (SAC) solder flow in two closely placed pin through holes (PTH's). The CFD results provide insights which can't be readily achieved through pure experimentation only. The influence of pre-heat temperature is also discussed." @default.
- W2345481035 created "2016-06-24" @default.
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- W2345481035 date "2016-04-01" @default.
- W2345481035 modified "2023-10-05" @default.
- W2345481035 title "CFD analysis of wave soldering interpin behaviour" @default.
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- W2345481035 doi "https://doi.org/10.1109/eurosime.2016.7463356" @default.
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