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- W2348925401 abstract "With the development of miniaturization and multi-functionality of electronic products,the feature size of packaging joints was getting smaller and the current density was increased sharply.So,the failure problem of solder joints induced by electromigration was getting more and more seriously.The electromigration in the solder joints induced the accumulation of hillocks,extrusion,whiskers and even plastic forming in the anode,voids and cracks in the cathode.It decreased the reliability of the solder joints and lead to short circuit or open circuit which made the electronic products failing rapidly.This paper introduced the currently study of electromigration on lead-free solder of Sn-Cu,Sn-Ag,Sn-Ag-Cu,Sn-Zn and Sn-Bi both at home and abroad,the effect mechanism of electromigration on the reliability of lead-free solder joints was also analyzed and commented." @default.
- W2348925401 created "2016-06-24" @default.
- W2348925401 creator A5004063317 @default.
- W2348925401 date "2010-01-01" @default.
- W2348925401 modified "2023-09-25" @default.
- W2348925401 title "Electromigration in lead-free electronic packaging" @default.
- W2348925401 hasPublicationYear "2010" @default.
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