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- W2349793670 abstract "The oxidation reduction potential (ORP) of an acidic etching bath comprising CuCl2, CuCl, NaCl and HCl was measured, and its dependence on bath composition and temperature during etching and electrochemical regeneration processes was studied. The results showed that the ORP of acidic etching bath is decreased with increasing mass concentration of Cu+, and is directly proportional to the logarithm of the mass concentration of Cu+ when the mass concentration of Cu2+ is relatively high or when the mass concentration of total Cu varies slightly. The dissolved oxygen in acidic etching bath, as well as the concentration of Cu2+, Cl? and H+, and temperature have certain impact on ORP measurement, but the maximum error is not more than 0.9%. The ORP is in direct proportion to temperature when the bath composition is unvaried. The measurement of ORP can indicate the etching velocity and electrochemical regeneration process in acidic etching bath." @default.
- W2349793670 created "2016-06-24" @default.
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- W2349793670 date "2010-01-01" @default.
- W2349793670 modified "2023-09-23" @default.
- W2349793670 title "ORP measurement of acidic CuCl2–HCl etching bath and its application" @default.
- W2349793670 hasPublicationYear "2010" @default.
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