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- W2349866741 abstract "As the high thermal conductivity,the low coefficient of thermal expansion,Mo-Cu alloy is widely used in electrical contact material,heat sink material and sealing material to ceramics,and etc.Preparation method and the process of densification are described.The problems in production are discussed,and the development trend is also surveyed." @default.
- W2349866741 created "2016-06-24" @default.
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- W2349866741 date "2013-01-01" @default.
- W2349866741 modified "2023-09-23" @default.
- W2349866741 title "RESEARCH PROGRESS OF Mo-Cu ALLOY" @default.
- W2349866741 hasPublicationYear "2013" @default.
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