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- W2350027449 abstract "The surface blacking of Sn-Bi solder joints reflowed by solder paste and black substance during reflow were studied by using SEM,EDX,XRD,etc.through two methods: direct test of black residue on the solder joint surface and extraction and test of black substance in high temperature.Results show that the main reasons of causing solder joint blackening relate Bi,and formations of Bi or Bi oxide are based on the reflow conditions." @default.
- W2350027449 created "2016-06-24" @default.
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- W2350027449 date "2013-01-01" @default.
- W2350027449 modified "2023-09-23" @default.
- W2350027449 title "Analysis of Sn-Bi solder joint blacking" @default.
- W2350027449 hasPublicationYear "2013" @default.
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