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- W2350871392 abstract "AgWNi contact material was prepared by infiltration method.Sintering behavior of AgWNi and effect of Ni additive on physical and mechanical properties were studied.Density of contact material was investigated by Archimede and microstructure was researched by microscope and SEM.The results show that wettability of Ag-W was improved obviously by addition of Ni.Compared to AgW55 contact material,the hardness was increased by 14.48%,98%～99% of relative density was obtained(increased by 1.23%) and resistivity was decreased by 3.9%." @default.
- W2350871392 created "2016-06-24" @default.
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- W2350871392 date "2010-01-01" @default.
- W2350871392 modified "2023-09-26" @default.
- W2350871392 title "Research on the Preparation of AgWNi Contact Material Used in Miniature Circuit Breaker" @default.
- W2350871392 hasPublicationYear "2010" @default.
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