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- W2352437797 abstract "The bubble's largest pressure method was employed to measure the surface tension of melting Sn-9Zn-XBi solder alloys. Wetting balance method was used to evaluate the wetting behavior of these solders on Cu substrate. With addition of Bi, surface tension of Sn-Zn melts obviously can be reduced. ZnO usually forms at the surface of Sn-Zn melts, which results the increase of surface tension of the alloys after exposed them to air for 1 min. With addition of Bi, wetting force on Cu substrate of Sn-Zn serial alloys increases, and wetting time of the alloys decreases. The wetting force of the Sn-9Zn-XBi alloys is obviously lower than that of Sn-40Pb, which distributes to higher interfacial tension between the Sn-Zn alloy and Cu substrate." @default.
- W2352437797 created "2016-06-24" @default.
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- W2352437797 date "2005-01-01" @default.
- W2352437797 modified "2023-09-24" @default.
- W2352437797 title "Surface Tension and Wetting Behavior of Sn-Zn-Bi Lead-free Solders" @default.
- W2352437797 hasPublicationYear "2005" @default.
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