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- W2352733917 abstract "In this paper,crucial structure of digital microphone are introduced,and bonding technology is leaded into NiPdAu PCB,and achieve the high reliability connect.And according to the demand of bonding technology,a series of bonding experiments have been done,obtain some related data and matched skin membrane thick parameter." @default.
- W2352733917 created "2016-06-24" @default.
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- W2352733917 date "2011-01-01" @default.
- W2352733917 modified "2023-09-26" @default.
- W2352733917 title "Study on Bonding Technology of Digital Microphone of NiPdAu PCB" @default.
- W2352733917 hasPublicationYear "2011" @default.
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