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- W2353263024 abstract "Three problems of solid mechanics for micro electro mechanical systems are discussed: (1)Mechanical behavior of interfacial region for the components of microsystem: By using the strain gradient theory, the theoretical analysis shows the existense of boundary layer near interfaces and the significance of strain gradient effects on interfacial deformation. (2)Crack growth on the interface of thin film/substrate structures: the residual stress in the film induced by the mechanical and thermal mismatch in the manufacture is an important cause of initialization and extension of interface crack. The modified three parameters ( Γ 0, /σ s, t ) cohesive model was used to investigate the cleavage fracture under outer plastic deformation fields. A typical resistance curves have been calculated by using finite element method. (3)Elastic plastic contact mechanics considering adhesive effects: A non linear spring element has been used to simulate the adhesive force. Through specific quantitative analysis, two parameters of the adhesive force ( Γ 0, ) are adopted. After a simple review on the research status in the topics shown above, some new results for three problems are presented." @default.
- W2353263024 created "2016-06-24" @default.
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- W2353263024 date "2001-01-01" @default.
- W2353263024 modified "2023-09-24" @default.
- W2353263024 title "SOME PROBLEMS OF SOLID MECHANICS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS" @default.
- W2353263024 hasPublicationYear "2001" @default.
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