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- W2354202904 abstract "Copper were hot-dipped aluminum through one-bath,the hot-dip time was 10-25 s,the hot-dip temperature was 963-1 013 K.The effects of hot-dip temperature and time on the diffusion layer thickness of the Cu/Al composite were studied.Cu/Al composites interfacial diffusion layer growth kinetics model,based on hot-dip aluminum test,was established.The results showed that The growth kinetics of the interfacial diffusion layer of Cu/Al composite is in accordance with the parabolic diffusion and the interfacial diffusion layer thickness of Cu/Al composite is proportional to the index of hot-dip coating temperature and has a parabolic growth relationship with the hot-dipping time;the correction coefficient k of growth kinetics model of diffusion layer of copper hot-dipping aluminum has a linear relationship with time." @default.
- W2354202904 created "2016-06-24" @default.
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- W2354202904 date "2015-01-01" @default.
- W2354202904 modified "2023-09-23" @default.
- W2354202904 title "Diffusion layer growth kinetics model of copper hot-dipping aluminum coating" @default.
- W2354202904 hasPublicationYear "2015" @default.
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