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- W2354645153 abstract "In order to analyze the thermal stability of the pure copper after the ECAP,the recrystalization annealing test at different temperatures was conducted,and the microstructure was analyzed,and the mechanical properties were tested.The results show that the ECAP pure copper has a high strength and good thermal stability below 240 ℃,but the strength decreases dramatically and the thermal stability becomes worse above 240 ℃." @default.
- W2354645153 created "2016-06-24" @default.
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- W2354645153 date "2008-01-01" @default.
- W2354645153 modified "2023-09-25" @default.
- W2354645153 title "Investigation of Thermal Stability of Pure Copper After ECAP" @default.
- W2354645153 hasPublicationYear "2008" @default.
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