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- W2354770059 abstract "The temperature control of SMT reflow is one of the important factors for affecting the quality of the electronic products.The temperature difference of reflow oven based on the conventional PID control is big,which is unable to meet the needs of soldering for electronic products.The temperature control of SMT reflow based on fuzzy PID controller was studied.The results show that the deviation between the reflow process curve based on the fuzzy PID controller and the setting curve is-2-2℃,the average mean of the absolute value of temperature deviation is 1.7℃.The controller has better stability,higher precision and practicability." @default.
- W2354770059 created "2016-06-24" @default.
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- W2354770059 date "2013-01-01" @default.
- W2354770059 modified "2023-09-23" @default.
- W2354770059 title "Research on Temperature Control of SMT Reflow Oven Based on Fuzzy PID Technique" @default.
- W2354770059 hasPublicationYear "2013" @default.
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