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- W2355592912 abstract "With the rapid growth of Integrate Circuit (IC), Chemical Mechanical Polishing (CMP) is widely used in semiconductor industry as global planarization method, but, people mostly depends on experience during Chemical Mechanical Polishing, and little know deeply and really about CMP mechanism. In this paper, a technology of Laser Induced Fluorescence (LIF) is used for studying the mechanism of Chemical Mechanical Polishing. With the LIF technology, we can visualize the slurry flow between the wafer and the pad. During CMP, the slurry flow, slurry mixing, the thin film thickness, temperature and pH of slurry can be known with the LIF technology and the mechanism is exposed." @default.
- W2355592912 created "2016-06-24" @default.
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- W2355592912 date "2008-01-01" @default.
- W2355592912 modified "2023-09-23" @default.
- W2355592912 title "Research on Chemical Mechanical Polishing Mechanism Based on Laser Induced Fluorescence Technology" @default.
- W2355592912 hasPublicationYear "2008" @default.
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