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- W2356006962 abstract "Thermal path and the corresponding thermal resistance of high-power LED is analyzed and calculated.The heat flow analysis and heat dissipation optimal design of high-power LED is realized by using commercial computational fluid dynamics(CFD)software.Theoretical calculation result shows that the total thermal resistance of high-power LED from the junction to the ambient is 28.67 ℃/W.When the dissipated power is 1 W and the ambient temperature is 25 ℃,the junction temperature of high-power LED is 53.67 ℃.Simulation result shows that on the same working conditions the junction temperature of high-power LED is 54.85 ℃.It is good agreement with the theoretical calculation results.The results show that when the area of heat dissipation increases to a certain value,the heat dissipation effect remains a constant.Thus,considering the lower product costs,the area of heat sink has a threshold range.When the heat sink is installed for the vertical fins to the left,the air-fluid flow on unimpeded,the heat dissipation has the best effect,and the junction temperature of high-power LED is lowest." @default.
- W2356006962 created "2016-06-24" @default.
- W2356006962 creator A5024827632 @default.
- W2356006962 date "2010-01-01" @default.
- W2356006962 modified "2023-09-26" @default.
- W2356006962 title "Thermal Management and Heat Dissipation Design for High-power LEDs" @default.
- W2356006962 hasPublicationYear "2010" @default.
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