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- W2356130650 abstract "Electroless nickel plating(ENP) is introduced to realize interconnection for a photosensitive array and CMOS read-out circuit(ROIC) in uncooled infrared focal plane array(UIRFPA) fabrication process.It has advantages of selective deposition and no requirement for external current source supply.The effective interconnection pencent can be over 85% by using this technology for 32×32 UIRFPA fabrication process.The method is certified as a simple,low cost and reliable method for interconnection between IRFPA and ROIC." @default.
- W2356130650 created "2016-06-24" @default.
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- W2356130650 date "2008-01-01" @default.
- W2356130650 modified "2023-09-25" @default.
- W2356130650 title "APPLICATION OF ELECTROLESS Ni PLATING IN INFRARED FPA FABRICATION" @default.
- W2356130650 hasPublicationYear "2008" @default.
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