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- W2356336768 abstract "The relationship between the defect distribution of bonding wafer and W eibull modulus is discussed. This relation is confirmed by experimentations,and it can explain why wafer bon-ding strength is changed by annealing temperature." @default.
- W2356336768 created "2016-06-24" @default.
- W2356336768 creator A5052115159 @default.
- W2356336768 date "2004-01-01" @default.
- W2356336768 modified "2023-09-23" @default.
- W2356336768 title "The defect distribution of bonded wafers and its relationship to the Weibull modulus" @default.
- W2356336768 hasPublicationYear "2004" @default.
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