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- W2356503822 abstract "Chemical mechanical polishing (CMP) technique of sapphire substrate was introduced in this paper. CMP theory and equipment were summarized.The factors that influence polishing rate and quality were emphatically discussed. The trends of CMP are as follows: CMP technology could be quantified, process parameters could be systematically studied, perfect CMP theory model could be established to meet different technological demands and applying fields, to reduce cost and enhance output." @default.
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- W2356503822 date "2004-01-01" @default.
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- W2356503822 title "Research of Chemical Mechanical Polishing Technique of Sapphire Substrate" @default.
- W2356503822 hasPublicationYear "2004" @default.
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