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- W2356550018 abstract "Lead-free solder alloys are widely used in electronic packaging. However, due to the limitation of their high melting point(210~240 ℃), a great temperature must be applied during soldering. The increased working temperature not only increases the energy consumption but also threatens the joint reliability. Nano lead-free solder alloys are being attracted more and more attentions because the melting point of an alloy in nano size is much lower than that in normal size due to the thermodynamic size effect. Review the recent domestic and international developments of the nano lead-free solder alloys, introduce their preparation methods and influencing factors, summarize the problem during their application and storage, and finally, propose some advice in their industrial implementation." @default.
- W2356550018 created "2016-06-24" @default.
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- W2356550018 date "2014-01-01" @default.
- W2356550018 modified "2023-09-25" @default.
- W2356550018 title "Current Status of Nanolead-Free Solder Alloys" @default.
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