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- W2356629782 abstract "The copper coating were deposited on the surface of diamond powder using chemical deposition.The plating rate,organization and surface morphology were changed by the temperature of plating bath,which was investigated through X-ray diffraction technique and scanning electron microscope analysis.The results showed that the plating rate was zero and no reaction could occur when the temperature was lower than 30℃.The intensity of copper peak strengthened with the increase of the temperature when the temperature was in the range of 30-45 ℃.The substrate was coating of copper completely,and the coating was uniform and dense when the temperature was 45℃.The copper peak intensity was further enhanced,the grain size was significantly larger,the coating density decreased and had a exfoliation phenomenon when the temperature was at 45-50℃.The copper peak intensity weakened with the increasing of the temperature when the temperature was above 50℃.The plating had an obvious exfoliation and edge curl phenomenon when the temperature was at 60℃." @default.
- W2356629782 created "2016-06-24" @default.
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- W2356629782 date "2014-01-01" @default.
- W2356629782 modified "2023-09-23" @default.
- W2356629782 title "Effect of temperature on electroless copper plating onto the surface of diamond powder" @default.
- W2356629782 hasPublicationYear "2014" @default.
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