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- W2356750733 abstract "The unique wavelength and processing characteristics of ultraviolet (UV) laser,bring tremendous progress for wafer cutting process.In this paper,the advantage of UV laser cutting technology is discussed.The development and application of UV laser cutting for wafer cutting process are summarized.The limitation of traditironal microelectronic cutting methods for wafer cutting process is discussed.The principle ,characteristics and advantages of several wafer cutting methods are introduced。 The traditironal microelectronic cutting methods and UV laser cutting methods are compared with each other in experiment.and the trend of UV laser cutting technology is viewed." @default.
- W2356750733 created "2016-06-24" @default.
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- W2356750733 date "2010-01-01" @default.
- W2356750733 modified "2023-09-24" @default.
- W2356750733 title "Research on Advantages of UV Laser in Semiconductor Wafer Cutting" @default.
- W2356750733 hasPublicationYear "2010" @default.
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