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- W2357708814 abstract "To use the 3CG120 correctly under high temperature,the papre studied the failure mechanism under high temperaure.In the experiments,silicon samples,3CG120 transistor was subjected to temperature progress stress form 443 to 613K.After the test,failure mechanisms in different temperature ranges were studied.And the failure mechanism in different ranges are unconsistant.And the tempreture,at which the failure mechanisms will change from room temperature,was accqured." @default.
- W2357708814 created "2016-06-24" @default.
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- W2357708814 date "2012-01-01" @default.
- W2357708814 modified "2023-09-23" @default.
- W2357708814 title "Failure mechanism analysis of 3CG120 under high temperature" @default.
- W2357708814 hasPublicationYear "2012" @default.
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