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- W2357975093 abstract "Using AG-80 epoxy resin as the main resin,reaction product of carboxy terminated butadiene-acrylo nitrile (CTBN) and 1.6-hexanediol diglycidyl ether as the active toughening diluents, nano aluminum nitride (AlN) as the thermal conductive filler and aminal-105 as the curing agent, the thermally conductive potting was prepared. The results indicated that when the amount of active toughening agents is 20 parts per 100 parts of epoxy resin, the mechanical and heat resistant properties of the potting is good, and when the content of heat conductive filler is 12 percents by weight, the thermal conductivity of the potting is 0.85 W/m·k, which can meet the operating requriements." @default.
- W2357975093 created "2016-06-24" @default.
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- W2357975093 date "2010-01-01" @default.
- W2357975093 modified "2023-09-25" @default.
- W2357975093 title "Preparation of thermally conductive epoxy potting" @default.
- W2357975093 hasPublicationYear "2010" @default.
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