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- W2358085608 abstract "With the development of electronic technology,good performance of thermal conductivity is needed for the printed circuit board(PCB) in high frequency and high speed.Novel polymer materials are developed to obtain high thermal conductivity.However,the methods of filling common polymers with inorganic fillers are effective to improve the thermal conductivity of PCB in low price,compared with high-price and high-thermal-conductivity polymer materials.Thermal conductivity of filled composites could be predicted with theoretical model.The study of thermal-conductivity performance of filled composites is summarized respectively through morphology,distribution and surface modification of inorganic fillers." @default.
- W2358085608 created "2016-06-24" @default.
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- W2358085608 date "2011-01-01" @default.
- W2358085608 modified "2023-09-23" @default.
- W2358085608 title "Research development on thermal-conductivity materials used in high frequency and high speed printed circuit board" @default.
- W2358085608 hasPublicationYear "2011" @default.
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