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- W2358718644 abstract "Thin film stress is a key factor of functional materials for whether it can be used in MEMS field or not.This paper studied the effect of electrodeposition and heat treatment on the thin film stress of Ni-W alloy in the system of citrate amine-HEDP,and its applications in micro-nozzle.The results show that in the optimum process,the nanocrystalline Ni-W film without crack can be obtained,and its stress is 230 MPa,hardness is 988 HV.In this way,Ni-W film may be widely applied in the manufacture of MEMS device and micro-molding." @default.
- W2358718644 created "2016-06-24" @default.
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- W2358718644 date "2007-01-01" @default.
- W2358718644 modified "2023-09-26" @default.
- W2358718644 title "Fabrication of Low Stress Ni-W Nanocrystalline for MEMS Devices" @default.
- W2358718644 hasPublicationYear "2007" @default.
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