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- W2358930130 abstract "The mechanism of formation of passive film on copper in CH_3NH_2-K_3[Fe(CN)_6] solution was studied with cyclic voltammetry technique.By large-scale potential scanning,the relation of oxidation peak current,oxidation peak potential,the ratio of oxidation and deoxidiation peak current to corresponding scan rate of potential was investigated.The results showed that the relation of oxidation peak current or oxidation peak potential to the square root of the scan rate of potential was linear,and the degree of coverage by the film was independent of scan rate of potential,and the mechanism of formation of the passive film accorded with the Muller Model.During the formation process of passive film, there were transformed chemical postposition reactions.Copper anode firstly dissolved because of losing an electron by the depolarizer,then Cu_4[Fe(CN)_6] passive film was formed by the transformed chemical reactions.During chemical-mechanical polishing,the corrosion current density and polishing rate of copper with such passive film increased with increase of the rotative rate." @default.
- W2358930130 created "2016-06-24" @default.
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- W2358930130 date "2005-01-01" @default.
- W2358930130 modified "2023-09-25" @default.
- W2358930130 title "Study on the mechanism about formation of passive film on copper in CH_3NH_2-K_3[Fe(CN)_6]" @default.
- W2358930130 hasPublicationYear "2005" @default.
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