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- W2358946080 abstract "A chip thermal model is established for power amplifier in X-band T/R module in this paper.The method and formulas for obtaining thermal resistance are presented,analysis and calculation are carried out for equivalent chip thermal circuit.Thermal conductivities for materials commonly encountered in assemblies are presented.For different bottom material of the package,the maximum rated system heat sink temperature is calculated under condition of guaranteeing the power amplifier chip have reliable operating temperature.Thus,for the module designer we provide a basis to optimize cost of the T/R module.Finally,some suggestions are put forward for improving the reliability of power chip." @default.
- W2358946080 created "2016-06-24" @default.
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- W2358946080 date "2010-01-01" @default.
- W2358946080 modified "2023-09-26" @default.
- W2358946080 title "Thermal Design of Power Amplifier Chip in X-band T/R Module" @default.
- W2358946080 hasPublicationYear "2010" @default.
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