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- W2358986047 abstract "This paper introduced three different method of the chip package system, at the same time compared the advantage and disadvantage of them. In according to the development of the future technology, the chip-last embedded active was emphasized here." @default.
- W2358986047 created "2016-06-24" @default.
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- W2358986047 date "2008-01-01" @default.
- W2358986047 modified "2023-09-23" @default.
- W2358986047 title "The Embedded Active Technology for Microelectronic System" @default.
- W2358986047 hasPublicationYear "2008" @default.
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