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- W2359124979 abstract "Controlled Collapse Chip Connection (C4) technology is gaining increasing popularity because it achieves high electrical interconnects speed, high density and low profile packages. While this technology gains more and more popularity, the problem of CTE mismatch between chip and substrate becomes more serious with the larger size of chips and smaller size of solder joints. Underfill encapsulant is introduced to reinforce physical, mechanical, and electrical properties of the solder joints in C4 packages. Therefore, the mechanical properties of underfill materials play an important role for the reliability of flip chip packages. In this paper, the C4 technology is introduced with emphasis on its manufacturing process, reliability, as well as some newly developments. Studies on mechanical properties of underfill materials used in C4 packaging, as well as their impacts on the reliability of C4 packages are reviewed." @default.
- W2359124979 created "2016-06-24" @default.
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- W2359124979 date "2002-01-01" @default.
- W2359124979 modified "2023-09-25" @default.
- W2359124979 title "NOVEL CONTROLLED COLLAPSE CHIP CONNECTION TECHNOLOGY AND STUDIES ON MECHANICAL PROPERTIES OF UNDERFILL MATERIALS" @default.
- W2359124979 hasPublicationYear "2002" @default.
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