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- W2359882654 abstract "Molecular simulations using MEAM(Modified Embedded Atom Method) potentials have been applied to research the interfacial properties of the different(hkl) Cu substrate in the soldering.In the simulation,the surface energies and the process of Sn spreading on the different(hkl) copper plate surface were simulated,and the results show that the different(hkl) plane substrates have few effects to the soldering spreading process,the solid-liquid interfacial energy is still the dominant ingredient practically in the wetting process." @default.
- W2359882654 created "2016-06-24" @default.
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- W2359882654 date "2009-01-01" @default.
- W2359882654 modified "2023-09-26" @default.
- W2359882654 title "Molecular Simulations in Tin Droplet Spreading on Different Surface of Copper Plate" @default.
- W2359882654 hasPublicationYear "2009" @default.
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