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- W2360147602 abstract "A numerical method called interaction integral method was used to compute the stress intensity factor(SIF) of surface crack in homogeneous materials and bimaterials subjected to remote tension.The result agrees with the classical solution obtained by GOSZ well.Then this method was applied to solve the stress intensity factor of surface crack for bimaterial subjected to thermal stress.The influence of crack shape,model thickness,crack depth and Young's modulus on the SIFs was analyzed in detail.The SIF changed intensely when the a/c was small.The KII was significantly influenced by the model depth that was close to the crack depth,whereas it changed negligibly when the model depth was large enough.In addition,the influence of thermal stress on SIF was negligible if the properties of the bi-material matched each other well,and vice versa." @default.
- W2360147602 created "2016-06-24" @default.
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- W2360147602 date "2011-01-01" @default.
- W2360147602 modified "2023-09-22" @default.
- W2360147602 title "Stress intensity factor of surface crack for bimaterial under thermal stress" @default.
- W2360147602 hasPublicationYear "2011" @default.
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