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- W2361355056 abstract "To improve the wetting behavior of diamond and metallic matrix,the electroless plating of copper on diamond particles was introduced using two formulations with different reducing agents,and the copper films of diamond were deoxidized at different temperatures in the atmosphere of hydrogen.The changes of structure and composition of copper films grown at different formulations and reduction temperatures were characterized by scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results show that the copper films obtained by application of potassium borohydride is mainly nano-crystalline and the film quality is better than that of formaldehyde.When the deoxidization temperature is 300 ℃,the cuprous oxide is reduced to copper.This temperature has little influence on the morphology of the film and there is no grain growth found.The surface of copper films keep smooth and uniform.With temperature increasing,the grain size and surface roughness of copper films increases gradually.Meanwhile,the colour of diamonds that copper films has been electroless plated becomes dim from original light purple." @default.
- W2361355056 created "2016-06-24" @default.
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- W2361355056 date "2010-01-01" @default.
- W2361355056 modified "2023-09-23" @default.
- W2361355056 title "Investigation of electroless plating of copper on diamond and related deoxidization treatment" @default.
- W2361355056 hasPublicationYear "2010" @default.
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