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- W2362971315 abstract "The samples of copper/steel wire are manufactured by reversing solidification technology, and the tin distribution and the effect on microstructure, hardness, resistivity of the samples are analyzed. The result show that tin is distributed on the surface of the sample made by reversing solidification, and the grain is fined, the hardness and resistivity are increased. Based on the comprehensive property of the copper wire, the optimum content of tin is 0.8% , and the copper wire with these components will be practically applied." @default.
- W2362971315 created "2016-06-24" @default.
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- W2362971315 date "2005-01-01" @default.
- W2362971315 modified "2023-09-23" @default.
- W2362971315 title "Distribution of Sn in Cu/Steel Wire and Effect on Microstructure and Properties" @default.
- W2362971315 hasPublicationYear "2005" @default.
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