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- W2363622444 abstract "The finite element models which included die,adhesive layer with adhesive void and substrate were set up,the effects of adhesive layer thickness,adhesive void area and adhesive void location on the stress within adhesive layer have been studied under thermal cycle.By using an L25(56) orthogonal array,25 adhesive layer with different combinations of adhesive layer thickness,adhesive void area and adhesive void location were designed,the stresses in the 25 adhesive layer have been evaluated and the variance analysis of the stress values were performed.The results show that the adhesive layer has the minimum stress with adhesive void located at the four corners,the stresses decrease with the increase of the adhesive layer thickness,the stresses at first decrease and then increase with the increasing adhesive void area.With 95% confidence the adhesive layer thickness and adhesive void location have significant effect on the stresses whereas the adhesive void area has little effect on the stresses,the impact sequence from high to low on the stresses are the adhesive layer thickness,the adhesive void location and the adhesive void area." @default.
- W2363622444 created "2016-06-24" @default.
- W2363622444 creator A5090791642 @default.
- W2363622444 date "2012-01-01" @default.
- W2363622444 modified "2023-09-23" @default.
- W2363622444 title "STRESS ANALYSIS OF DIE ADHESIVE LAYER WITH ADHESIVE VOID UNDER THERMAL CYCLE" @default.
- W2363622444 hasPublicationYear "2012" @default.
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