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- W2363884927 abstract "In the aspect of thermal dispersion for power LEDs,flip-chip configuration has potential predominance.The temperature distribution of power LEDs is measured,and the performance of thermal dispersion is discussed.The analytical results show that the solder material,contact area and processing quality of solder layer will be main factors restricting the ability of thermal dispersion for flip-chip configuration LEDs.Meanwhile,the normal LED chips emitting light from p-side are possible to reach the same thermal dispersion performance as the flip-chip bonded LEDs through adopting appropriate bonding technique and optimizing chip structure." @default.
- W2363884927 created "2016-06-24" @default.
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- W2363884927 date "2006-01-01" @default.
- W2363884927 modified "2023-09-25" @default.
- W2363884927 title "Thermal Dispersion of GaN-based Power LEDs" @default.
- W2363884927 hasPublicationYear "2006" @default.
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