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- W2364165034 abstract "MCM-C/D technology based on LTCC possesses advantages of LTCC and thin film technology.In order to prepare LTCC multilayer substrate suiting thin film process,the effects of lamination pressure and sintering temperature on LTCC density are investigated.The results show that the laminating pressure doesn’t affect the density significantly.But sintering temperature plays important role in affecting the density of the LTCC substrate.Lower sintering temperature higher sintering temperature results in poorer sintering density.The optimized sintering temperature should be around 875℃.The substrate prepared with optimized parameters can be polished to achieve roughness Ra value of 10~15 nm and meet thin film process basically.The minimum line width and space of the experimental thin film pattern on LTCC substrate are 20/20 μm." @default.
- W2364165034 created "2016-06-24" @default.
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- W2364165034 date "2012-01-01" @default.
- W2364165034 modified "2023-09-24" @default.
- W2364165034 title "Study on Low Temperature Cofired Ceramic Substrate for Thin Film Process" @default.
- W2364165034 hasPublicationYear "2012" @default.
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