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- W2364176070 abstract "A low viscosity epoxy resin should be used in RTM,casting and filling.The system is prepared by modifying Bisphenol A epoxy.The viscosity,mechanical properties as well as thermal stability are characterized,which show that the prepared epoxy has long pot life at normal temperature.After cured at medium temperature,the mechanical properties and thermal stability are good." @default.
- W2364176070 created "2016-06-24" @default.
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- W2364176070 date "2008-01-01" @default.
- W2364176070 modified "2023-09-23" @default.
- W2364176070 title "THE BASIC PROPERTIES OF LOW VISCOSITY EPOXY RESIN CURED AT MEDIUM TEMPERATURE" @default.
- W2364176070 hasPublicationYear "2008" @default.
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