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- W2364281989 abstract "During metal film deposition,affecting factors were simulated through finite element method(FEM).Five models of describing the movements of the rigid spheres reached C or Si substrate such as Pt、Pt-Ru、Pt-Ti、Pt-Ni、Pt-Al were mainly discussed.Some important factors such as the difference ratio of different atoms' radius,dynamics power of incidence particles and the incident angle,which should been considered in thin film deposition were discussed.And the rationality and suitability of the finite element method in micro-fields were tested." @default.
- W2364281989 created "2016-06-24" @default.
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- W2364281989 date "2007-01-01" @default.
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- W2364281989 title "Finite element method simulation of affecting factors during metal thin film deposition" @default.
- W2364281989 hasPublicationYear "2007" @default.
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