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- W2364668166 abstract "Tetrahedral amorphous carbon films were deposited on the 200mm silicon wafer by means of off-plane-double-bend filtered cathodic vacuum arc system. The uniformity of film thickness, which is less than 5%, is verified by Dectek3 surface profiler. The properties and structure were investigated by SEM, AFM, Raman spectroscopy, XPS and Nano-Indenter. It shows that the films are tetrahedral amorphous carbon films. The content of sp3 in the films is beyond 80%. The surface of the films is clear and is nearly not polluted by macroparticles. The value of Rq is less than 0.3 nm in the given area of 1μm2. The hardness of the films is close to 50 GPa and the Young's modulus is more than 550 GPa." @default.
- W2364668166 created "2016-06-24" @default.
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- W2364668166 date "2003-01-01" @default.
- W2364668166 modified "2023-09-27" @default.
- W2364668166 title "Tetrahedral amorphous carbon films deposited by filtered cathodic vacuum arc technology" @default.
- W2364668166 hasPublicationYear "2003" @default.
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