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- W2364684555 abstract "The bonding of multi-layer of glass and aluminum stack was achieved by the common anode bonding process.The bonding mechanism and mechanical property of the glass/aluminum/glass joints were investigated in the paper.The mechanical property and the residual stress of the glass/aluminum/glass bonded wafers were analyzed by means of the micro-tension test and the software of ANSYS.It is founded that the bonding area is consisted of the glass-transition layer-aluminum,and the transition layer is the combined metal oxide of the Al2O3-SiO2.The microstructure and distribution of the elements are symmetrical in both sides of the aluminum interfaces.The residual stress and strain near the bonded interface are symmetrical in the bonding area of the multi-layer glass/aluminum/glass.The symmetry property of the multi-layer structure is beneficial to mechanical property of the joints.It indicates that the multi-layer glass/aluminum/glass wafers can be bonded firm due to the application of a common anode process." @default.
- W2364684555 created "2016-06-24" @default.
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- W2364684555 date "2008-01-01" @default.
- W2364684555 modified "2023-09-23" @default.
- W2364684555 title "The interface microstructure and mechanical property of the multi-layer wafer of pyrex glass and Al by the common anode bonding process" @default.
- W2364684555 hasPublicationYear "2008" @default.
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