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- W2364795760 abstract "The effects of Fe particles on the viscosity,melting point,microstructure,wettability and mechanical properties of Sn-3Ag-0.5Cu solder paste were investigated.The results show that the addition of Fe particles with micro size increases the contact area between the solder balls and friction force of solder pastes,which is due to the increasing viscosity of solder paste.The density of Fe is higher than that of the Sn-3Ag-0.5Cu,and Fe particles are adsorbed to the interface to increase the viscosity of liquid solder,so,the wettability of solder alloys are degraded.Compared with the Sn-3Ag-0.5Cu/Cu,the fine equiax crystal in Sn-3Ag-0.5Cu-Fe/Cu is found instead of the bulky β-Sn arborescent crystal.The shear strength of the Sn-3Ag-0.5Cu-1%Fe/Cu is 46 MPa,which is 39% higher than that of the Sn-3Ag-0.5Cu/Cu.The microhardness of the matrix increases approximately 25% as a result of incorporation of Fe particles." @default.
- W2364795760 created "2016-06-24" @default.
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- W2364795760 date "2012-01-01" @default.
- W2364795760 modified "2023-09-28" @default.
- W2364795760 title "Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder" @default.
- W2364795760 hasPublicationYear "2012" @default.
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