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- W2364852053 abstract "As the increase of density of heat flow,the thermal design of electronic equipment is getting more and more important.This paper takes an engineering device as example to analyze the thermal design.First,this paper determines the top design specification after related calculations based on the equipment technique specifications and the environment parameters.Then,the techniques are used,such as rational distribution of heat within chassis,rational distribution of hot modules on the circuit board,adding heat sinks and heat pipes to hot components,fans installation in case,etc.By grace to techniques described in the paper,the design objective of temperature control of the hot components has achieved." @default.
- W2364852053 created "2016-06-24" @default.
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- W2364852053 date "2011-01-01" @default.
- W2364852053 modified "2023-09-23" @default.
- W2364852053 title "Thermal Design Analysis on Sealed Electronic Equipment" @default.
- W2364852053 hasPublicationYear "2011" @default.
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