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- W2364980060 abstract "Due to the existence of the circuit stray inductance in insulated gate bipolar transistor(IGBT) modules, large voltage spikes caused in the transient process of the turn-on and turn-off can make the collector current of IGBT chips increase and lead to junction temperature rise. Voltage spike is an important factor which can cause IGBT modules failure. The finite element simulation software Ansoft Q3 D Extractor is used to calculate the stray parameters of wire bonding IGBT module and optimize its packaging structure. IGBT module with planar packaging structure is designed which can effectively reduce the stray parameters of IGBT module. Results show that stray inductance of the main loop of the planar packaging IGBT module is 11.365 n H, the resistance is 0.409 m ?, and compared with wire bonding structure of IGBT module, stray inductance is reduced by 55.1%, the resistance is reduced by 13.2%." @default.
- W2364980060 created "2016-06-24" @default.
- W2364980060 creator A5010203885 @default.
- W2364980060 date "2015-01-01" @default.
- W2364980060 modified "2023-09-23" @default.
- W2364980060 title "Stray Parameters Calculation and Packaging Design of IGBT Modules" @default.
- W2364980060 hasPublicationYear "2015" @default.
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