Matches in SemOpenAlex for { <https://semopenalex.org/work/W2365395893> ?p ?o ?g. }
Showing items 1 to 63 of
63
with 100 items per page.
- W2365395893 abstract "As electronic products are developing higher and higher density,the heat problem of PCB has attracted more and more attention,and thermal via is one of the most important technology to solving the heat problem.In the paper,the heat resistant performance of thermal via with different diameter and different pitch was assessed by lead-free reflow and thermal stress,and verified by TMA and TGA,discussing the way how to evaluate the heat resistant performance of thermal via." @default.
- W2365395893 created "2016-06-24" @default.
- W2365395893 creator A5058124469 @default.
- W2365395893 date "2011-01-01" @default.
- W2365395893 modified "2023-09-24" @default.
- W2365395893 title "Reliability testing of high density thermal via" @default.
- W2365395893 hasPublicationYear "2011" @default.
- W2365395893 type Work @default.
- W2365395893 sameAs 2365395893 @default.
- W2365395893 citedByCount "0" @default.
- W2365395893 crossrefType "journal-article" @default.
- W2365395893 hasAuthorship W2365395893A5058124469 @default.
- W2365395893 hasConcept C116915560 @default.
- W2365395893 hasConcept C121332964 @default.
- W2365395893 hasConcept C127413603 @default.
- W2365395893 hasConcept C137693562 @default.
- W2365395893 hasConcept C159985019 @default.
- W2365395893 hasConcept C163258240 @default.
- W2365395893 hasConcept C192562407 @default.
- W2365395893 hasConcept C204530211 @default.
- W2365395893 hasConcept C2986087423 @default.
- W2365395893 hasConcept C43214815 @default.
- W2365395893 hasConcept C78519656 @default.
- W2365395893 hasConcept C97355855 @default.
- W2365395893 hasConceptScore W2365395893C116915560 @default.
- W2365395893 hasConceptScore W2365395893C121332964 @default.
- W2365395893 hasConceptScore W2365395893C127413603 @default.
- W2365395893 hasConceptScore W2365395893C137693562 @default.
- W2365395893 hasConceptScore W2365395893C159985019 @default.
- W2365395893 hasConceptScore W2365395893C163258240 @default.
- W2365395893 hasConceptScore W2365395893C192562407 @default.
- W2365395893 hasConceptScore W2365395893C204530211 @default.
- W2365395893 hasConceptScore W2365395893C2986087423 @default.
- W2365395893 hasConceptScore W2365395893C43214815 @default.
- W2365395893 hasConceptScore W2365395893C78519656 @default.
- W2365395893 hasConceptScore W2365395893C97355855 @default.
- W2365395893 hasLocation W23653958931 @default.
- W2365395893 hasOpenAccess W2365395893 @default.
- W2365395893 hasPrimaryLocation W23653958931 @default.
- W2365395893 hasRelatedWork W2017654072 @default.
- W2365395893 hasRelatedWork W2077106409 @default.
- W2365395893 hasRelatedWork W2101223972 @default.
- W2365395893 hasRelatedWork W2280863850 @default.
- W2365395893 hasRelatedWork W2341473176 @default.
- W2365395893 hasRelatedWork W2350244345 @default.
- W2365395893 hasRelatedWork W2491024040 @default.
- W2365395893 hasRelatedWork W2761855546 @default.
- W2365395893 hasRelatedWork W2789347535 @default.
- W2365395893 hasRelatedWork W2903424723 @default.
- W2365395893 hasRelatedWork W2907758033 @default.
- W2365395893 hasRelatedWork W2916177552 @default.
- W2365395893 hasRelatedWork W2978357748 @default.
- W2365395893 hasRelatedWork W2984556503 @default.
- W2365395893 hasRelatedWork W3010909104 @default.
- W2365395893 hasRelatedWork W3020461980 @default.
- W2365395893 hasRelatedWork W3116347471 @default.
- W2365395893 hasRelatedWork W3188697743 @default.
- W2365395893 hasRelatedWork W3213431816 @default.
- W2365395893 hasRelatedWork W2887232963 @default.
- W2365395893 isParatext "false" @default.
- W2365395893 isRetracted "false" @default.
- W2365395893 magId "2365395893" @default.
- W2365395893 workType "article" @default.