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- W2366318307 abstract "With the rapid development of information industry,the requirements for flatness degree on semiconductor devices and optical devices were higher.As the primary means of ultra-precision machining,double side lapping and polishing machining could obtain wafer with higher accuracy of the shape and surface accuracy.However,the edge collapse phenomenon in the double side lapping and polishing machining leaded to poor flatness degree of the work piece.In this paper,those factors that lead to the edge collapse and the solutions in the double side lapping and polishing machining were discussed.This paper has a more prominent and significant meaning to improve the quality of the double side lapping and polishing machining." @default.
- W2366318307 created "2016-06-24" @default.
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- W2366318307 date "2010-01-01" @default.
- W2366318307 modified "2023-09-25" @default.
- W2366318307 title "Research on the Edge Collapse Phenomenon of the Parts in Double Side Lapping and Polishing Machining" @default.
- W2366318307 hasPublicationYear "2010" @default.
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